News | The expertise laboratory: technical assets at the heart of our IFTEC services
The expertise laboratory: technical assets at the heart of our IFTEC services
Based at their Bourg-la-Reine site, the IFTEC analysis laboratory enhances their training and certification offer by providing industry with genuine technical support.
Their team carries out a wide range of expert work:
🔬 Micrographic sections (destructive testing)
Analysis of your bare or assembled printed circuit boards and wire assemblies: sampling, cold resin coating, sanding and polishing, microscopic examination (down to the micron). Precise detection of defects such as cracks, smearing, cavities, etc. Process validation, intermetallic measurement, structural inspection and/or dimensional measurement.
📈 Ion contamination measurements
Assessment of surface contamination on electronic boards using an immersive protocol. Quantified results in µg/cm² NaCl using the “Static” measurement method in accordance with IPC-TM-650/2.3.25 §6 and CNES-ECSS-Q-70-08A § 11.3.4-b.
🔎 Visual checks (non-destructive testing)
Binocular and/or KEYENCE examination of your bare or assembled PCBs to IPC-A-610 and IPC-A-600, as well as your wired assemblies to IPC/WHMA-A-620 criteria. Possibility of taking account of your customer specifications, with documented report.
🌡️ Climatic tests
Extreme exposure (+10°C to +90°C) in controlled humidity (10% to 95% RH), SIR-Surface Insulation Resistance (insulation) and Bono (corrosion) tests. PC-controlled chamber, programmable cycles. These climatic tests help accelerate aging and visualize its consequences.
🔧 Solderability measurements of printed circuit boards by flotation (destructive testing)
On printed circuit boards, by floating a sample on a bath of molten alloy, then observing alloy rise in plated holes. Certification to NFC 93713 or J-STD-003.
🔧 Solderability measurements of electronic component terminations (destructive testing)
– Measurement of solderability using the “wetting balance” or meniscograph bath method. Measurement results can be expressed in terms of angle or force: wetting angle according to NFC 90550 and A 89400 or wetting force according to J-STD 002 and J-STD 004.
– Solderability measurements by the globule method to IEC 68-2-69
💥 Tensile tests on wire assemblies (destructive testing)
Tested to IPC/WHMA-A-620 and IEC 60352-2 with tensile forces up to 2500N to test the quality of wire assemblies
X-ray analysis, and others after feasibility study.
Contact
📞 +33 (0)1 45 47 02 00
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