X-FAB is now able to provide a foundry service for the integration of passive devices

Highly optimized solution achieves major miniaturization goals

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has further strengthened its extensive RF expertise by announcing new integrated passive device (IPD) manufacturing capabilities. Just before European Microwave Week (September 17-22 in Berlin), it unveiled the XIPD process. Event attendees will be able to discuss this innovation with the company’s technical staff (located at booth 438C).

XIPD is derived from the popular 130nm X-FAB XR013 SOI RF process and leverages an engineered substrate as well as a thick copper metallization layer. The technology allows customers to integrate passive elements (inductors, capacitors and resistors) directly into the design of their devices, resulting in significant space and cost savings. Manufacturing is undertaken at X-FAB’s facilities in Corbeil-Essonnes, France, capitalizing on the company’s extensive experience in copper metallization.
The continued deployment of 5G cellular infrastructure as well as the development of 6G communications and the emergence of the latest generation of radar and satellite communications technologies require devices with broader frequency support. Through the use of the XIPD platform, demands for more compact RF/EMI filtering, matching networks, baluns and couplers can be met – through the manufacturing of fully integrated, high-quality passive components with improved performance characteristics.

Instead of having to resort to the use of discrete or surface-mount passive components, which can be inconvenient due to high-frequency component deviation or increased component sourcing complexity, XIPD enables a much more efficient approach that streamlines overall system design and speeds up development cycles. , simplifies manufacturing and reduces the engineering expenses involved. Operation over a wide frequency range, from the sub-6 GHz band to the high end of the mmW band, can be supported.

X-FAB is unique in offering a European-based foundry service for integrated passive production of any size. A complete Process Design Kit (PDK) is available. This supports both Cadence and Keysight ADS design environments, allowing customers to perform accurate simulations and achieve a correct design of the complete RF subsystem the first time. Initial prototyping with several key customers has now begun.
“Even as RF semiconductor devices continue to shrink, the passive components that accompany them remain relatively large. This mismatch does not align well with the need for sleeker electronic equipment, resulting in excessive use of board area,” notes Rudi De Winter, CEO of X-FAB; “By adopting our XIPD technology, it is not only possible to achieve space savings of orders of magnitude, but it also translates into a reduction in associated costs. This has the potential to be a real game changer for our customer base, enabling the co-packaging of active and passive matrices, whilst achieving high yields.

Greg U’Ren, Director of RF Technology at new generation. Our XIPD solution adds value to the market by enabling our customers to achieve compact RF system designs, minimizing losses through the incorporation of fully integrated hardware. We are already working on projects requiring operation between 70 and 80 GHz, which would be unthinkable with a discrete passive arrangement.

More information about X-FAB here.