June 28, 2019 – In September 2018, the trade associations SEIPI (Semiconductor and Electronics Industries in the Philippines Foundation) and ACSIEL Alliance Electronique initiated a rapprochement aimed at establishing regular relations between their respective organizations.

After two meetings in Paris and Manila, the two parties signed a Memorandum of Understanding (MoU) on June 28, at the meeting of the Franco-Philippine Joint Economic Committee, in the presence of the Foreign Affairs Ministers and MEDEF International, to formalize long-term cooperation in 5 areas:
– raise the profile of each association in each country,
– build competitive advantages and support innovation projects in key technologies,
– develop exchanges of electronic goods and services between France and the Philippines,
– foster global relations between SMEs in the respective electronics sectors,
– increase industrial investment opportunities in each territory.

Presidents Dr. Dan Lachika (SEIPI) and Jean-Luc Estienne (ACSIEL) welcomed this bilateral agreement, which will strengthen their electronics industries and the position of their members in their respective countries. They warmly thanked the embassies for their essential contribution to this new collaboration.

In their concluding remarks, Minister Lopez of the Philippines and Minister Lemoyne of France underlined the excellent spirit of the agreement, the mutual desire to strengthen and develop cooperation between industrialists and researchers from both organizations, and the strong desire for cooperation in the design and development of electronic components in general, and future-generation integrated circuits in particular.

Last but not least, the two ministers underlined the economic importance of local production in the electronics value chain in their countries, from upstream component manufacturing, equipment, electronic board assembly and testing, to downstream integration in end-user systems.

This agreement is a first lever for a long-term collaboration that both parties hope will strongly contribute to electronic innovations for mutual benefit.